The NXP Precision and Advanced Interfaces (PAI) product line is developing a family of precision mixed-signal SoC for the fast growing Industry 4.0 and factory automation market. Our solution combines high-voltage robustness, ultra-high dynamic range, as well as unparalleled software programmability. We are working with some of the largest and most influential industrial OEMs to build the next generation factory. To accelerate the proliferation of this product family, the R&D team is expanding its footprint in multiple locations across the globe.

Your Responsibilities:

Successful candidate should demonstrate experience with:

• Taking high-resolution data converters, precision voltage reference, associated IP into high-volume production.

• Designing custom circuitry on ATE load boards for testing high precision products with regard to layout lane matching / symmetry. Component selection with attention to noise, linearity, and tempco.

• Working with Design engineers, product definer at the product concept stage to ensure proper design of characterization setups, DfT, and product manufacturability.

• DFT from design concept stage to manufacturability

• Characterizing and testing products like general purpose analog products (level shifters, real time clock, temperature sensors).

• PCB design skills for developing ATE loadboards, handler, prober interface and specifications.

• Driving multiple high volume product launch and production support.

• Working in a cross functional team environment working with Analog design, Digital design, System Definer, Product Engineering, Quality Engineering, Applications Engineering to deliver products on schedule on budget.

• Job includes all administrative aspects of Test engineering, i.e. customer support, data evaluation, report generation, setting test limits, production support, etc.

Your Profile:

• BSEE or higher and a minimum of 15 years of test development experience on high performance integrated circuits.

• Proven track record of innovative test techniques

• Experience on Advantest 93K and/or Teradyne Ultraflex testers or willingness to learn these test platforms.

• Profound understanding of digital, analog, and mixed signal device testing, characterization, product launch, and support.

• Experience with statistical data processing, DOEs, problem solving methodologies, cost reduction, and yield enhancement.

• Understanding PCB design for developing ATE loadboards and specifications.

• Working knowledge/experience with foundries, subcons.

• Working knowledge of fab processes and effect on test.

• Skill required in reliability, failure analysis, and circuit debug processes.

• Demonstrated ability to work collaboratively with a diverse, global product development team from product concept to high volume production.